
50-3186是一個兩分導熱環氧粘合劑。 變溫債券提供的各種基材。 50-3186是一個導熱低工作溫度性應用的理想擇。

50-3186是一個兩分導熱環氧粘合劑。 變溫債券提供的各種基材。 50-3186是一個導熱低工作溫度性應用的理想擇。
50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance.
| Compound Type | Thermally Conductive |
| Material Form | Die Bonding Adhesives; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
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