20-3001是一種低粘度填充環氧樹灌封和封系統的形式就像完成一個泡沫玻璃時免治愈。
Epoxy Potting and Encapsulating Resin — 20-3001
20-3001 is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured.
技術參數/Specifications
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
環氧樹灌封和封樹-20-3001,環氧樹等..,電氣樹和電子化合物,Epoxy Potting and Encapsulating Resin , 20-3001, Epoxies Etc…, Electrical Resins and Electronic Compounds